D. D. Wang

Application of Fast Laser Deprocessing Techniques on large cross-sectional view area sample with FIB-SEM dual beam system

L. Zhu, Ran He, Hao Tan, 2016, Microelectron. Reliab..

ボンド‐パッドの問題に関する上のエッチングされた化学に及ぼすPFAにおけるレーザdeprocessing法の適用【Powered by NICT】

Yuzhe Zhao, Zhihong Mai, D. D. Wang, 2016 .

Top-down delayering to expose large inspection area on die side-edge with Platinum (Pt) deposition technique

Ran He, Y. Z. Zhao, B. Liu, 2015, Microelectron. Reliab..

Application of laser deprocessing technique in PFA on chemical over-etched on bond-pad issue

L. Zhu, Ran He, Y. Z. Zhao, 2016, Microelectron. Reliab..

Cross-sectional nanoprobing fault isolation technique on submicron devices

L. Zhu, Ran He, Y. Z. Zhao, 2016, Microelectron. Reliab..

Failure mechanism analysis and process improvement on time-dependent dielectric breakdown of Cu/ultra-low-k dielectric based on complementary Raman and FTIR spectroscopy study

Z. H. Mai, D. D. Wang, J. Lam, 2014, 2014 IEEE International Integrated Reliability Workshop Final Report (IIRW).

A developed wedge fixtures assisted high precision TEM samples pre-thinning method: Towards the batch lamella preparation

D. D. Wang, Binghai Liu, Z. Mai, 2017 .

Two planar polishing methods by using FIB technique: Toward ultimate top-down delayering for failure analysis

H. H. Yap, D. D. Wang, P. K. Tan, 2015 .

Structural and composition investigations at delayered locations of low k integrated circuit device by gas-assisted focused ion beam

D. D. Wang, P. K. Tan, J. Lam, 2014 .

Key Issues for Implementing Smart Polishing in Semiconductor Failure Analysis

Yamin Huang, Zhihong Mai, Lei Zhu, 2017 .

A sample preparation methodology to reduce sample edge unevenness and improve efficiency in delayering the 20-nm node IC chips

H. H. Yap, D. D. Wang, P. K. Tan, 2015, 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits.