Roy W. Knight

Accelerated aging and thermal cycling of low melting temperature alloys as wet thermal interface materials

Michael C. Hamilton, Chandan K. Roy, Sushil Bhavnani, 2015, Microelectron. Reliab..

A Numerical Study of Single Phase Dielectric Fluid Immersion Cooling of Multichip Modules

Sushil Bhavnani, R. Wayne Johnson, Roy W. Knight, 2012 .

Impact of surface enhancements upon boiling heat transfer in a liquid immersion cooled high performance small form factor server model

Sushil Bhavnani, R. Wayne Johnson, Roy W. Knight, 2014, Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

TIM Selection for an IGBT Cold Plate Using Experimental and Numerical Modeling

Sushil H. Bhavnani, Roy W. Knight, John F. Maddox, 2013 .

Optimal Thermal Design of Forced Convection Heat Sinks-Analytical

Roy W. Knight, J. S. Goodling, R. Knight, 1991 .

Optimal thermal design of air cooled forced convection finned heat sinks-experimental verification

Roy W. Knight, J. S. Goodling, B. E. Gross, 1992 .

Solder joint reliability of surface mount chip resistors/capacitors on insulated metal substrates

Roy W. Knight, J. C. Suhling, Chris S. Romanczuk, 1994, 1994 Proceedings. 44th Electronic Components and Technology Conference.

Non-uniform thermal properties of an alumina granule/epoxy potting compound

Sushil H. Bhavnani, Roy W. Knight, John F. Maddox, 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Effect of system and operational parameters on the performance of an immersion-cooled multichip module for high performance computing

Sushil H. Bhavnani, R. Wayne Johnson, Roy W. Knight, 2014, 2014 Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).