D. Bouchu
发表
L. Di Cioccio,
P. Coudrain,
S. Moreau,
2014,
2014 IEEE International Reliability Physics Symposium.
L. Arnaud,
A. Toffoli,
F. de Crecy,
2008,
2008 IEEE International Conference on Microelectronic Test Structures.
F. Fournel,
A. Jouve,
Y. Henrion,
2019,
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
C. Aumont,
T. Mourier,
C. Ribiere,
2015,
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
V. Arnal,
L. Pain,
A. Farcy,
2008,
2008 International Interconnect Technology Conference.
R. Franiatte,
R. Anciant,
S. Cheramy,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
L. Arnaud,
E. Deloffre,
A. Farcy,
2018,
2018 IEEE International Electron Devices Meeting (IEDM).
J. Michelon,
Alexis Farcy,
Roel Daamen,
2005
.
J. Cluzel,
A. Toffoli,
G. Haury,
2010,
2010 International Electron Devices Meeting.