N. Owens

A Study of Component-Level Measure of Board-Level Drop Impact Reliability by Ball Impact Test

Yi-Shao Lai, E.H. Wong, R. Rajoo, 2008, 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference.

Advances in the drop-impact reliability of solder joints for mobile applications

Willem D. van Driel, N. Owens, Ee-Hua Wong, 2009, Microelectron. Reliab..

Correlation studies for component level ball impact shear test and board level drop test

Willem D. van Driel, N. Owens, Ee-Hua Wong, 2008, Microelectron. Reliab..

Recent advances in drop-impact reliability

E.H. Wong, W.D. van Driel, J.F.J.M. Caers, 2008, EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.

High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies

Yi-Shao Lai, N. Owens, Ranjan Rajoo, 2009 .

A study of crack propagation in Pb-free solder joints under drop impact

Yi-Shao Lai, E.H. Wong, W.D. van Driel, 2008, 2008 58th Electronic Components and Technology Conference.

Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling

Yi-Shao Lai, N. Owens, D. R. Frear, 2008 .

Stress–strain characteristics of tin-based solder alloys at medium strain rate

Yi-Shao Lai, N. Owens, D. R. Frear, 2008 .

A Comprehensive Test Method for Bridging the Gap between Product and Board Level Drop Tests

E.H. Wong, N. Owens, S.K.W. Seah, 2008, 2008 10th Electronics Packaging Technology Conference.