Yue Ying Ong

Underfill selection methodology for fine pitch Cu/low-k FCBGA packages

Zhong Chen, Kai Chong Chan, Yeow Kheng Lim, 2009, Microelectron. Reliab..

Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package

John H. Lau, Xiaowu Zhang, Vempati Srinivasa Rao, 2010, Microelectron. Reliab..

Assembly and reliability of micro-bumped chips with Through-silicon Vias (TSV) interposer

Vempati Srinivasa Rao, Tai Chong Chai, Ming Chinq Jong, 2009, 2009 11th Electronics Packaging Technology Conference.

Development of Large Die Fine-Pitch Cu/Low- $k$ FCBGA Package With Through Silicon via (TSV) Interposer

Tai Chong Chai, Shiguo Liu, Yue Ying Ong, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.