Mostafa Said

A design methodology and various performance and fabrication metrics evaluation of 3D Network-on-Chip with multiplexed Through-Silicon Vias

Farhad Mehdipour, Ahmed Shalaby, Morteza Biglari-Abhari, 2016, Microprocess. Microsystems.

Keep-Out-Zone analysis for three-dimensional ICs

Farhad Mehdipour, Mostafa Said, Mohamed El-Sayed, 2014, Technical Papers of 2014 International Symposium on VLSI Design, Automation and Test.

Significance of early thermal management for 3D FPGAs at partitioning stage

Kazuaki Murakami, Farhad Mehdipour, Krishna Chaitanya Nunna, 2016, 2016 International Conference on Microelectronics, Computing and Communications (MicroCom).

Thermal-aware network-on-chips: Single- and cross-layered approaches

Fayez Gebali, Ahmed Shalaby, Mostafa Said, 2019, Future Gener. Comput. Syst..

Performance evaluation of buffer sharing routers for Network on Chip

HyungWon Kim, Hossam Hassan, Mostafa Said, 2016, 2016 IEEE 59th International Midwest Symposium on Circuits and Systems (MWSCAS).

Work-in-Progress: A Flexible Router Architecture for 3D NoCs

Ahmed Shalaby, Mostafa Khamis, Mostafa Said, 2017, 2017 IEEE Real-Time Systems Symposium (RTSS).

Understanding the Sources of Power Consumption in Mobile SoCs

Sherief Reda, Adel Belouchrani, Sofiane Chetoui, 2018, 2018 Ninth International Green and Sustainable Computing Conference (IGSC).

Improving Performance and Fabrication Metrics of Three-Dimensional ICs by Multiplexing Through-Silicon Vias

Farhad Mehdipour, Mostafa Said, Mohamed El-Sayed, 2013, 2013 Euromicro Conference on Digital System Design.

A Design Methodology for Performance Maintenance of 3D Network-on-Chip with Multiplexed Through-Silicon Vias

Farhad Mehdipour, Kazuaki Murakami, Mostafa Said, 2014, MES@ISCA.

A novel power reduction technique using wire multiplexing

HyungWon Kim, Hossam Hassan, Mostafa Khamis, 2017, 2017 30th IEEE International System-on-Chip Conference (SOCC).

A Survey on the Security of Wired, Wireless, and 3D Network-on-Chips

Ahmad Patooghy, Abdel-Hameed A. Badawy, Ahmed Khalid, 2021, IEEE Access.

A Design Methodology and Various Performance and Fabrication Metrics Evaluation of 3 D Network-on-Chip with Multiplexed Through-Silicon Vias

Farhad Mehdipour, Morteza Biglari-Abhari, Mostafa Said, 2015 .