Guanghai Xu

Transistor Performance Impact Due to Die–Package Mechanical Stress

J. Hicks, D. Pantuso, G. S. Leatherman, 2013, IEEE Transactions on Device and Materials Reliability.

Low-к - package integration challenges and options for reliability qualification

A. E. Lucero, Guanghai Xu, D. Huitink, 2012, 2012 IEEE International Reliability Physics Symposium (IRPS).

Influence of network bond percolation on the thermal, mechanical, electrical and optical properties of high and low-k a-SiC:H thin films

Yusuke Matsuda, Lauren R. Olasov, Sean W. King, 2013 .

The Energy Release Rate for Decohesion in Thin Multilayered Films on Substrates

David R. Clarke, Guanghai Xu, Qing Ma, 1997 .

Cohesive strength characterization of brittle low-k films

Guanghai Xu, J. Bielefeld, J. Bielefeld, 2002, Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519).

Initiation and arrest of an interfacial crack in a four-point bend test

Zhigang Suo, Jean-Herve Prevost, Zhenyu Huang, 2005 .