P. Lall

发表

System Design Issues for Harsh Environment Electronics Employing Metal-Backed Laminate Substrates

J.L. Evans, P. Lall, R. Knight, 2008, IEEE Transactions on Components and Packaging Technologies.

Thermo-mechanical reliability tradeoffs for deployment of area array packages in harsh environments

P. Lall, N. Singh, J.C. Suhling, 2005, IEEE Transactions on Components and Packaging Technologies.

Solder Joint Reliability in Electronics Under Shock and Vibration Using Explicit Finite-Element Submodeling

P. Lall, S. Gupte, P. Choudhary, 2006, IEEE Transactions on Electronics Packaging Manufacturing.

Prognostics Health Monitoring (PHM) for Prior-Damage Assessment in Electronics Equipment under Thermo-Mechanical Loads

P. Lall, J. Suhling, M. Hande, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Latent damage assessment and prognostication of residual life in airborne lead-free electronics under thermo-mechanical loads

P. Lall, J. Suhling, M. Hande, 2008, 2008 International Conference on Prognostics and Health Management.

Level of damage and remaining useful life assessment in leadfree electronics subjected to multiple thermo-mechanical environments

P. Lall, K. Goebel, M. Harsha, 2012, 2012 IEEE Conference on Prognostics and Health Management.

Decision-Support Models for Thermo-Mechanical Reliability of Leadfree Flip-Chip Electronics in Extreme Environments

P. Lall, N. Singh, M. Strickland, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Modeling and reliability characterization of area-array electronics subjected to high-g mechanical shock up to 50,000g

P. Lall, J. Blanche, K. Patel, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Prognostics and Health Management of Electronic Packaging

P. Lall, J.C. Suhling, M.N. Islam, 2006, IEEE Transactions on Components and Packaging Technologies.

Cohesive-Zone Explicit Submodeling for Shock Life-Prediction in Electronics

P. Lall, S. Gupte, P. Choudhary, 2009, IEEE Transactions on Components and Packaging Technologies.

Feature extraction and health monitoring using image correlation for survivability of leadfree packaging under shock and vibration

P. Lall, J. Suhling, D. Iyengar, 2008, EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.

Health monitoring for damage initiation & progression during mechanical shock in electronic assemblies

P. Lall, S. Gupte, P. Choudhary, 2006, 56th Electronic Components and Technology Conference 2006.

Anomaly Detection and Classification for PHM of Electronics Subjected to Shock and Vibration

P. Lall, P. Gupta, A. Angral, 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

A framework for reliability modeling of electronics

P. Lall, J. Evans, R. Bauernschub, 1995, Annual Reliability and Maintainability Symposium 1995 Proceedings.

Principal component regression models for life prediction of plastic ball grid arrays on copper-core and no-core assemblies

P. Lall, J. Suhling, A. Shirgaokar, 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Leading indicators for prognostic health management of electrical connectors subjected to random vibration

P. Lall, K. Goebel, R. Lowe, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Statistical Pattern Recognition and Built-in Reliability Test for Feature Extraction and Health Monitoring of Electronics Under Shock Loads

P. Lall, S. Gupte, P. Choudhary, 2007, IEEE Transactions on Components and Packaging Technologies.

Statistical Pattern Recognition and Built-in Reliability Test for Feature Extraction and Health Monitoring of Electronics under Shock Loads

P. Lall, S. Gupte, P. Choudhary, 2009, 2007 Proceedings 57th Electronic Components and Technology Conference.

Life Prediction and Damage Equivalency for Shock Survivability of Electronic Components

P. Lall, J. Suhling, D. Iyengar, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

Comparison of particle filter using SIR algorithm with self-adaptive filter using ARMA for PHM of Electronics

P. Lall, K. Goebel, Hao Zhang, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Classification of location of damage in package-on-package (PoP) assemblies using ANN with feature vectors for progression of accrued damage

P. Lall, K. Goebel, P. Gupta, 2012, 2012 IEEE Conference on Prognostics and Health Management.

Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging

P. Lall, J.C. Suhling, S. Gupte, 2008, IEEE Transactions on Components and Packaging Technologies.

A physics-of-failure (POF) approach to addressing device reliability in accelerated testing of MCMs

P. Lall, M. J. Cushing, R. Bauernschub, 1995, Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95).

Models for Reliability Prediction of Fine-Pitch BGAs and CSPs in Shock and Drop-Impact

P. Lall, J. Suhling, Yueli Liu, 2004, IEEE Transactions on Components and Packaging Technologies.

Corner bonding of CSPs: processing and reliability

R.W. Johnson, P. Lall, M.N. Islam, 2005, IEEE Transactions on Electronics Packaging Manufacturing.

Comparison of Lalman-filter and extended Kalman-filter for prognostics health management of electronics

P. Lall, K. Goebel, Junchao Wei, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Algorithms for prognostication of prior damage and residual life in lead-free electronics subjected to thermo-mechanical loads

P. Lall, J. Suhling, M. Hande, 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Challenges in accelerated life testing

P. Lall, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

Prognostics Health Monitoring (PHM) for Prior Damage Assessment in Electronics Equipment Under Thermo-Mechanical Loads

P. Lall, M. Hande, C. Bhat, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Computational Methods and High Speed Imaging Methodologies for Transient-Shock Reliability of Electronics

P. Lall, 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.

Cohesive-Zone Explicit Sub-Modeling for Shock Life-Prediction in Electronics

P. Lall, S. Gupte, P. Choudhary, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Development of survivability envelopes for SnAg leadfree packaging architecures under shock and vibration

P. Lall, J. Suhling, D. Iyengar, 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Health Monitoring for Damage Initiation and Progression During Mechanical Shock in Electronic Assemblies

P. Lall, J.C. Suhling, S. Gupte, 2008, IEEE Transactions on Components and Packaging Technologies.

Leading indicator based assessment of operational readiness in electronics subjected to multiple environments

P. Lall, J. Suhling, K. Goebel, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Classification of multiple failure modes in package-on-package (PoP) assemblies using feature vectors for progression of accrued damage

P. Lall, K. Goebel, P. Gupta, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Cost assessment for implementation of embedded prognostic health management for electronic systems

P. Lall, K. Goebel, R. Lowe, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Leading Indicators of Failure for Prognostication of Leaded and Lead-Free Electronics in Harsh Environments

P. Lall, J.C. Suhling, P. Choudhary, 2009, IEEE Transactions on Components and Packaging Technologies.

Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging

P. Lall, S. Gupte, P. Choudhary, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Health monitoring of implantable biological electronic systems by statistical pattern recognition techniques

P. Lall, P. Gupta, J. Suhling, 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Thermal reliability considerations for Deployment of area array packages in harsh environments

P. Lall, M. Strickland, J. Blanche, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

Fundamentals of delamination initiation and growth in flip chip assemblies

P. Lall, M.K. Rahim, R. Jaeger, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Characterization of die stresses in flip chip on laminate assemblies using

P. Lall, M.K. Rahim, R. Jaeger, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Model for BGA and CSP reliability in automotive underhood applications

P. Lall, R. Darveaux, P. Lall, 2004, IEEE Transactions on Components and Packaging Technologies.

Reliability of flip chip assemblies subjected to extreme low temperatures

P. Lall, M. Strickland, J.C. Suhling, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

Assessment of Accrued Damage and Remaining Useful Life in Leadfree Electronics Subjected to Multiple Thermal Environments of Thermal Aging and Thermal Cycling

P. Lall, K. Goebel, V. More, 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Computer Aided Design And Reliability Assessment Of Microelectronic Packages

P. Lall, C. A. Rust, E. B. Hakim, 1970 .

High-G shock reliability of ceramic area-array packages

P. Lall, K. Patel, M. Strickland, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Damage mechanics of electronics on metal-backed substrates in harsh environments

P. Lall, T. Shete, P. Lall, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Impelementatoin of a viscoelastic model for the temperature dependent material behavior of underfill encapsulants

P. Lall, J. C. Suhling, P. Lall, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Sustained damage and remaining useful life assessment in leadfree electronics subjected to sequential multiple thermal environments

P. Lall, K. Goebel, M. Harsha, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Characterization of die stresses in microprocessor packages subjected to thermal cycling

R. C. Jaeger, P. Lall, Jordan Roberts, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Effect of high strain-rate on mechanical properties of SAC105 and SAC305 leadfree alloys

P. Lall, S. Shantaram, P. Lall, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Determination of Anand constants for SAC solders using stress-strain or creep data

P. Lall, J. C. Suhling, M. Motalab, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Reliability modeling of electronic systems subjected to high strain rates

P. Lall, S. Shantaram, P. Lall, 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Reliability of lead-free SAC electronics under simultaneous exposure to high temperature and vibration

P. Lall, W. Cooper, P. Lall, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Measurement of thermally induced die stresses in flip chip on laminate assemblies

P. Lall, M.K. Rahim, R.W. Johnson, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

High Speed Digital Image Correlation for Transient-Shock Reliability of Electronics

P. Lall, D. Iyengar, S. Shantaram, 2007, IEEE Transactions on Components and Packaging Technologies.

Die stress characterization in flip chip on laminate assemblies

P. Lall, M.K. Rahim, R. Jaeger, 2005, IEEE Transactions on Components and Packaging Technologies.

Design Envelopes and Optical Feature Extraction Techniques for Survivability of SnAg Lead-free Packaging Architectures Under Shock and Vibration

P. Lall, D. Iyengar, S. Shantaram, 2008, IEEE Transactions on Electronics Packaging Manufacturing.

Reliability characterization of the SLICC package

P. Lall, P. Thompson, K. Banerji, 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.

Nano-Underfills for High-Reliability Applications in Extreme Environments

P. Lall, Guoyun Tian, J. Suhling, 2005, IEEE Transactions on Components and Packaging Technologies.

Time-frequency and auto-regressive techniques for prognostication of shock-impact reliability of implantable biological electronic systems

P. Lall, P. Gupta, P. Lall, 2008, 2008 58th Electronic Components and Technology Conference.

Improved predictions of lead free solder joint reliability that include aging effects

P. Lall, J. C. Suhling, Zijie Cai, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Continuous In-Situ Die Stress Measurements During Thermal Cycling Accelerated Life Testing

P. Lall, M.K. Rahim, R. Jaeger, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.