M. Gaynes

Extreme energy efficiency using water cooled servers inside a chiller-less data center

M. Iyengar, M. David, P. Parida, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Advanced flexible CMOS integrated circuits on plastic enabled by controlled spalling technology

M. Gaynes, A. Khakifirooz, D. Shahrjerdi, 2012, 2012 International Electron Devices Meeting.

Experimental investigation of water cooled server microprocessors and memory devices in an energy efficient chiller-less data center

M. Iyengar, M. David, V. Kamath, 2012, 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

Server liquid cooling with chiller-less data center design to enable significant energy savings

M. Iyengar, M. David, P. Parida, 2012, 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

Experimental characterization of an energy efficient chiller-less data center test facility with warm water cooled servers

M. Iyengar, M. Schultz, M. Gaynes, 2012, 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

Impact of operating conditions on a chiller-less data center test facility with liquid cooled servers

M. Gaynes, T. Chainer, R. Schmidt, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Wafer level underfill for area array Cu pillar flip chip packaging of ultra low-k chips on organic substrates

M. Gaynes, Jae-Woong Nah, C. Feger, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Flip chip attach with thermoplastic electrically conductive adhesive

M. Gaynes, M. Paquette, R. Kodnani, 1998, Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180).

High-efficiency thin-film InGaP/InGaAs/Ge tandem solar cells enabled by controlled spalling technology

Davood Shahrjerdi, Tayfun Gokmen, M. Gaynes, 2012 .

Underfill selection strategy for Pb-free, low-K and fine pitch organic flip chip applications

M. Gaynes, D. Questad, E. Duchesne, 2006, 56th Electronic Components and Technology Conference 2006.

A Practical Implementation of Silicon Microchannel Coolers for High Power Chips

M. Gaynes, J. Wakil, E. Colgan, 2007, IEEE Transactions on Components and Packaging Technologies.

Electrical contact failure mechanisms relevant to electronic packages

M. Gaynes, G. Kulwanoski, M. Gaynes, 1991, Electrical Contacts - 1991 Proceedings of the Thirty-Seventh IEEE HOLM Conference on Electrical Contacts.