J. H. Huang

Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies

Wei-Chung Lo, Yu-Hua Chen, Peng-Shu Chen, 2012, 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.

Process integration and reliability test for 3D chip stacking with thin wafer handling technology

J. H. Huang, Y. H. Chen, K. Chiang, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).