Jianzheng Hu

Thermal effects of moisture inducing delamination in light-emitting diode packages

Lianqiao Yang, Moo Whan Shin, Jianzheng Hu, 2006, 56th Electronic Components and Technology Conference 2006.

Mechanism and thermal effect of delamination in light-emitting diode packages

Lianqiao Yang, Moo Whan Shin, Jianzheng Hu, 2005, Microelectron. J..

Thermal and mechanical analysis of delamination in GaN-based light-emitting diode packages

Lianqiao Yang, Moo Whan Shin, Jianzheng Hu, 2006 .

Degradation of high power LEDs at dynamic working conditions

Lianqiao Yang, Moo Whan Shin, Jianzheng Hu, 2009 .

Electrical, optical and thermal degradation of high power GaN/InGaN light-emitting diodes

Lianqiao Yang, Moo Whan Shin, Jianzheng Hu, 2008 .

Thermal and Mechanical Analysis of High-Power LEDs With Ceramic Packages

Lianqiao Yang, Moo Whan Shin, Jianzheng Hu, 2008, IEEE Transactions on Device and Materials Reliability.

Dynamic Thermal Analysis of High-Power LEDs at Pulse Conditions

Lianqiao Yang, Moo Whan Shin, Jianzheng Hu, 2008, IEEE Electron Device Letters.

The ageing mechanism of high-power InGaN/GaN light-emitting diodes under electrical stresses

Lianqiao Yang, Moo Whan Shin, Lan Kim, 2007 .