Mathias Ekpu

Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device

Emeka H. Amalu, M. O. Alam, Sabuj Mallik, 2012, Microelectron. Reliab..

Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics

Sabuj Mallik, R. S. Bhatti, Kenny C. Otiaba, 2014, Microelectron. Reliab..

The effect of thermal constriction on heat management in a microelectronic application

Sabuj Mallik, R. S. Bhatti, Kenny C. Otiaba, 2014, Microelectron. J..

Finite element analysis of the effect of silver content for Sn–Ag–Cu alloy compositions on thermal cycling reliability of solder die attach

Ndy Ekere, Sabuj Mallik, R. S. Bhatti, 2013 .