Srikrishnan Venkataraman

Package design challenges and optimizations in density efficient (Intel® Xeon® processor D) SoC

Chunfei Ye, Arun Chandrasekhar, Qi Zhu, 2016, 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS).

Server CPU Package Design Using PoINT Architecture

Sriram Srinivasan, Krishna Bharath, Farzaneh Yahyaei-Moayyed, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Package Design Optimization for Intel SoC Xeon-D

Chunfei Ye, Arun Chandrasekhar, Qi Zhu, 2018, IEEE Transactions on Components, Packaging and Manufacturing Technology.