K. Schischke
发表
H. Reichl,
K. Schischke,
A. Middendorf,
2005,
Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005..
W. Wimmer,
K. Schischke,
N. F. Nissen,
2012,
2012 Electronics Goes Green 2012+.
K. Schischke,
T. Krivec,
R. Aschenbrenner,
2017,
2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition.
K. Schischke,
J. L. Ospina,
P. Maher,
2012,
2012 Electronics Goes Green 2012+.
K. Schischke,
H. Griese,
L. Stobbe,
2005,
Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC..
K. Schischke,
S. Prakash,
R. Liu,
2012,
2012 Electronics Goes Green 2012+.
H. Reichl,
K. Schischke,
L. Stobbe,
2008,
2008 IEEE International Symposium on Electronics and the Environment.
H. Reichl,
K. Schischke,
H. Griese,
2003,
2003 EcoDesign 3rd International Symposium on Environmentally Conscious Design and Inverse Manufacturing.
K. Schischke,
H. Griese,
I. Stobbe,
2004,
2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of.
H. Reichl,
K. Schischke,
H. Griese,
2004,
2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of.
K. Schischke,
H. Griese,
I. Stobbe,
2005,
Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC..
H. Reichl,
K. Schischke,
H. Griese,
2004,
IEEE International Symposium on Electronics and the Environment, 2004. Conference Record. 2004.
K. Schischke,
P. Chancerel,
J. C. Alonso,
2012,
2012 Electronics Goes Green 2012+.
I. Szendiuch,
K. Schischke,
2006,
2006 29th International Spring Seminar on Electronics Technology.
K. Schischke,
T. Krivec,
M. Schneider-Ramelow,
2019,
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
K. Schischke,
C. Fitzpatrick,
N. F. Nissen,
2012,
2012 Electronics Goes Green 2012+.
K. Schischke,
H. Griese,
M. Stutz,
2001,
Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190).
H. Reichl,
K. Schischke,
H. Griese,
2004,
Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04).
Herbert Reichl,
K. Schischke,
A. Middendorf,
2004
.
H. Reichl,
K. Schischke,
J. Mueller,
2006,
Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006..