C.K. Yoon

New 3-D Chip Stacking Architectures by Wire-On-Bump and Bump-On-Flex

R.R. Tummala, Baik-Woo Lee, Jui-Yun Tsai, 2008, IEEE Transactions on Advanced Packaging.

Chip-last Embedded Active for System-On-Package (SOP)

R.R. Tummala, V. Kripesh, Baik-Woo Lee, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.