Robert W. Kay

Stencil technology for wafer level bumping

Gerard Cummins, Marc P. Y. Desmulliez, Thomas Krebs, 2012, 2012 4th Electronic System-Integration Technology Conference.

Statistical analysis of stencil technology for wafer-level bumping

Marc P.Y. Desmulliez, Gerard Cummins, Eitan Abraham, 2014 .

A review of stencil printing for microelectronic packaging

Robert W. Kay, Marc P.Y. Desmulliez, M. Desmulliez, 2012 .

Microsystem Assembly Technology for the 21st Century (MAT21)

Marc P.Y. Desmulliez, Chris Bailey, G Glinski, 2002 .

Integration of additive manufacturing and inkjet printed electronics: a potential route to parts with embedded multifunctionality

Ji Li, Colm Connaughton, Jonathan D. Shephard, 2016 .

Computational modelling for reliable flip-chip packaging at sub-100mum pitch using isotropic conductive adhesives

Stoyan Stoyanov, Chris Bailey, Marc P. Y. Desmulliez, 2007, Microelectron. Reliab..