Daniel Rhee Min Woo

Optimization of the wafer level molding process for high power device module

Lin Bu, Siow Ling Ho, Dexter Velez Sorono, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).

Process development of multi-die stacking using 20 um pitch micro bumps on large scale dies

Daniel Rhee Min Woo, Lee Jong Bum, J. Li, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).

Extremely high temperature and high pressure (x-HTHP) endurable SOI device & sensor packaging for deep sea, oil and gas applications

F. X. Che, Daniel Rhee Min Woo, Eva Wai Leong Ching, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).

High power SiC inverter module packaging solutions for junction temperature over 220°C

Sorono Dexter Velez, Ho Siow Ling, Daniel Rhee Min Woo, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).

High-temperature endurable encapsulation material

Vivek Chidambaram, Daniel Rhee Min Woo, Ho Beng Yeung, 2012, 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).

Miniaturized Double Side Cooling Packaging for High Power 3 Phase SiC Inverter Module with Junction Temperature over 220°C

Daniel Rhee Min Woo, How Yuan Hwang, Lee Jong Bum, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Process development and optimization for high temperature endurable flip chip interconnection in SiC high power module

Daniel Rhee Min Woo, Hwang How Yuan, J. Aw, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).