Venky Sundaram
发表
Madhavan Swaminathan,
Venky Sundaram,
Sidharth Dalmia,
2001
.
Rao Tummala,
Sung Jin Kim,
Venky Sundaram,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Min Suk Kim,
Venky Sundaram,
Rao Tummala,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Joungho Kim,
Venky Sundaram,
Youngwoo Kim,
2013,
2013 IEEE International 3D Systems Integration Conference (3DIC).
Fuhan Liu,
Madhavan Swaminathan,
Venky Sundaram,
2003,
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).
Yogendra Joshi,
Venky Sundaram,
Rao Tummala,
2016
.
Venky Sundaram,
Youngwoo Kim,
Jonghyun Cho,
2013,
3DIC.
Rao Tummala,
Venky Sundaram,
Abhishek Choudhury,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Venky Sundaram,
Vanessa Smet,
2016,
2016 Pan Pacific Microelectronics Symposium (Pan Pacific).
Joungho Kim,
Rao Tummala,
Jihye Kim,
2015,
2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).
Venky Sundaram,
Qiao Chen,
Rao R. Tummala,
2009,
2009 IEEE Custom Integrated Circuits Conference.
Fuhan Liu,
Venky Sundaram,
George E. White,
2002,
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
Joungho Kim,
Pulugurtha Markondeya Raj,
Rao Tummala,
2017,
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).
Rao Tummala,
Fuhan Liu,
Venky Sundaram,
2010,
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Fuhan Liu,
Telesphor Kamgaing,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Madhavan Swaminathan,
Telesphor Kamgaing,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Fuhan Liu,
Venky Sundaram,
Rao Tummala,
2018
.
Rao Tummala,
Joungho Kim,
Sung Jin Kim,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
Joy Laskar,
Fuhan Liu,
Madhavan Swaminathan,
2002,
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
Madhavan Swaminathan,
Venky Sundaram,
Sidharth Dalmia,
2001,
Proceedings RAWCON 2001. 2001 IEEE Radio and Wireless Conference (Cat.No.01EX514).
Rao Tummala,
Joungho Kim,
Venky Sundaram,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Kyutae Lim,
Rao Tummala,
Joy Laskar,
2003
.
Ultra-thin and ultra-small 3D double-side glass power modules with advanced inductors and capacitors
Rao Tummala,
Min Suk Kim,
Venky Sundaram,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Venky Sundaram,
Vanessa Smet,
2017,
2017 Pan Pacific Microelectronics Symposium (Pan Pacific).
Venky Sundaram,
Parrish Ralston,
David Fry,
2017
.
Madhavan Swaminathan,
Venky Sundaram,
George E. White,
2006
.
Rao Tummala,
Fuhan Liu,
Sung Jin Kim,
2014,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Rao Tummala,
Sung Jin Kim,
Venky Sundaram,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
Madhavan Swaminathan,
Venky Sundaram,
Sidharth Dalmia,
2001,
IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565).
Hao Lu,
Venky Sundaram,
James Gunn,
2017
.
Fuhan Liu,
Venky Sundaram,
Sidharth Dalmia,
2001,
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
Joungho Kim,
Venky Sundaram,
Jonghyun Cho,
2016,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Joy Laskar,
Rao Tummala,
Fuhan Liu,
2002,
Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002..
Joy Laskar,
M. Maeng,
Madhavan Swaminathan,
2003,
53rd Electronic Components and Technology Conference, 2003. Proceedings..
Rao Tummala,
Venky Sundaram,
Vanessa Smet,
2015,
2015 European Microelectronics Packaging Conference (EMPC).
Rao Tummala,
Fuhan Liu,
Hao Lu,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Venky Sundaram,
Sidharth Dalmia,
P. Monajemi,
2006
.
Fuhan Liu,
Venky Sundaram,
George E. White,
2003,
53rd Electronic Components and Technology Conference, 2003. Proceedings..
Min Suk Kim,
Joungho Kim,
Kyungjun Cho,
2018,
Microelectron. J..
Joungho Kim,
Venky Sundaram,
Heegon Kim,
2014,
2014 International 3D Systems Integration Conference (3DIC).
Rao Tummala,
Fuhan Liu,
Venky Sundaram,
2000
.
Venky Sundaram,
Rao R. Tummala,
Sangbeom Cho,
2015,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Fuhan Liu,
Chandrasekharan Nair,
Venky Sundaram,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Venky Sundaram,
William Vis,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Venky Sundaram,
Abhishek Choudhury,
Rao R. Tummala,
2009,
2009 59th Electronic Components and Technology Conference.
Rao Tummala,
Venky Sundaram,
Sebastian Gottschall,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
Rao Tummala,
Venky Sundaram,
Vanessa Smet,
2014,
IEEE CPMT Symposium Japan 2014.
Rao Tummala,
Madhavan Swaminathan,
Venky Sundaram,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
Farrokh Ayazi,
Madhavan Swaminathan,
Venky Sundaram,
2002,
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
Joungho Kim,
Rao Tummala,
Venky Sundaram,
2014,
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC).
Rao Tummala,
Fuhan Liu,
Venky Sundaram,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Venky Sundaram,
Markondeya Raj Pulugurtha,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Joungho Kim,
Venky Sundaram,
Srikrishna Sitaraman,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Rao Tummala,
Fuhan Liu,
Venky Sundaram,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Madhavan Swaminathan,
Venky Sundaram,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
Rao Tummala,
Venky Sundaram,
Vanessa Smet,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Venky Sundaram,
Vanessa Smet,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Fuhan Liu,
Armand R. Tanguay,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Venky Sundaram,
Vanessa Smet,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Fuhan Liu,
Venky Sundaram,
2001,
Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562).
Venky Sundaram,
Junki Min,
Markondeya Raj Pulugurtha,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Andrew F. Peterson,
Venky Sundaram,
Kadappan Panayappan,
2016,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Pulugurtha Markondeya Raj,
Rao Tummala,
Venky Sundaram,
2014,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Manos M. Tentzeris,
Venky Sundaram,
Rao R. Tummala,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Fuhan Liu,
Venky Sundaram,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Fuhan Liu,
Madhavan Swaminathan,
Venky Sundaram,
2009,
2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS).
Rao Tummala,
Fuhan Liu,
Madhavan Swaminathan,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Joungho Kim,
Pulugurtha Markondeya Raj,
Kyungjun Cho,
2017,
IEEE Transactions on Electromagnetic Compatibility.
Madhavan Swaminathan,
Venky Sundaram,
Hunter Chan,
2010,
2010 IEEE Radio and Wireless Symposium (RWS).
Venky Sundaram,
Markondeya Raj Pulugurtha,
Rao R. Tummala,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Rao Tummala,
Madhavan Swaminathan,
Venky Sundaram,
2001,
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
Rao Tummala,
Fuhan Liu,
Venky Sundaram,
2010,
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Venky Sundaram,
Vanessa Smet,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Rao Tummala,
Venky Sundaram,
Himani Sharma,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Fuhan Liu,
Venky Sundaram,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Fuhan Liu,
Bartlet DeProspo,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Chandrasekharan Nair,
Venky Sundaram,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Fuhan Liu,
Chandrasekharan Nair,
Venky Sundaram,
2016,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Rao Tummala,
Venky Sundaram,
Saumya Gandhi,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Manos M. Tentzeris,
Venky Sundaram,
2017,
2017 IEEE 17th International Conference on Nanotechnology (IEEE-NANO).
Rao Tummala,
Madhavan Swaminathan,
Venky Sundaram,
2011,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Rao Tummala,
Fuhan Liu,
Madhavan Swaminathan,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Sung Kyu Lim,
Venky Sundaram,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Joungho Kim,
Rao Tummala,
Venky Sundaram,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Madhavan Swaminathan,
Venky Sundaram,
2001,
IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565).
Joungho Kim,
Rao Tummala,
Venky Sundaram,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Venky Sundaram,
Abhishek Choudhury,
2010,
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Venky Sundaram,
Kadappan Panayappan,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Manos M. Tentzeris,
Bijan Tehrani,
Venky Sundaram,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Fuhan Liu,
Chandrasekharan Nair,
Venky Sundaram,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Ryan Bahr,
Rao Tummala,
Venky Sundaram,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Joungho Kim,
Rao Tummala,
Venky Sundaram,
2015,
2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).
Rao Tummala,
Venky Sundaram,
Kadappan Panayappan,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).