Zhixian Min

Microstructure and shear strength of Sn37Pb/Cu solder joints subjected to isothermal aging

Yi Liu, Yong Liu, Yulong Li, 2014, Microelectron. Reliab..

A key parameters interval estimation method of the gold ribbon interconnect structure for the electrical performance of microwave modules

Yan Wang, Jun Tian, Congsi Wang, 2020, 2020 21st International Conference on Electronic Packaging Technology (ICEPT).

Interfacial reaction and growth behavior of IMCs layer between Sn–58Bi solders and a Cu substrate

Zhixian Min, Yulong Li, Xiaowu Hu, 2013, Journal of Materials Science: Materials in Electronics.

Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification

Yi Liu, Zhixian Min, Yulong Li, 2015 .

Effects of melt flow on the primary dendrite spacing of Pb–Sn binary alloy during directional solidification

Lei Wang, Zhixian Min, Hengzhi Fu, 2011 .

Microstructure evolution and mechanical properties of Sn0.7Cu0.7Bi lead-free solders produced by directional solidification

Ke Li, Zhixian Min, Xiaowu Hu, 2013 .