I. Erdin

发表

Fast EMC analysis high-speed interconnects with frequency-dependent parameters

M. Nakhla, R. Achar, N. Nakhla, 2006, 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006..

Circuit analysis of electromagnetic radiation and field coupling effects for networks with embedded full-wave modules

Ramachandra Achar, Michel Nakhla, I. Erdin, 2000 .

Simplified Macromodel of MTLs With Incident Fields (SiMMIF)

R. Achar, N.M. Nakhla, M.S. Nakhla, 2008, IEEE Transactions on Electromagnetic Compatibility.

Mixed circuit/electromagnetic analysis of radiation from high-speed interconnects

M. Nakhla, I. Erdin, 1999, 1999 IEEE MTT-S International Microwave Symposium Digest (Cat. No.99CH36282).

A SPICE model for incident field coupling to lossy multiconductor transmission lines

Ramachandra Achar, Anestis Dounavis, Michel Nakhla, 2001 .

Efficient SPICE macromodel for EMI analysis of electronic packages and high-speed interconnects

M. Nakhla, R. Achar, A. Dounavis, 2004, Electrical Performance of Electronic Packaging - 2004.

Analysis of multiconductor transmission lines with frequency-dependent parameters and incident electromagnetic fields

R. Achar, M. Nakhla, N. Nakhla, 2005, IEEE MTT-S International Microwave Symposium Digest, 2005..

Mixed circuit/electromagnetic analysis of field coupling to high speed interconnects in inhomogenous medium

M. Nakhla, I. Erdin, 1999, 1999 IEEE International Symposium on Electromagnetic Compatability. Symposium Record (Cat. No.99CH36261).

Fast transient analysis of incident field coupling to multiconductor transmission lines

R. Achar, N.M. Nakhla, M.S. Nakhla, 2006, IEEE Transactions on Electromagnetic Compatibility.

Delta-I noise suppression techniques in printed circuit boards for clock frequencies over 50 MHz

I. Erdin, 2003, 2003 IEEE International Symposium on Electromagnetic Compatibility, 2003. EMC '03..

Simulation of high-speed interconnects in a multilayered medium in the presence of incident field

Michel Nakhla, Roni Khazaka, I. Erdin, 1998 .

Fast IO buffer modeling using neural network methods

Q.J. Zhang, Y. Cao, I. Erdin, 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.

A genetic algorithm based interconnect discontinuity model for multi-Gb/s circuits

I. Erdin, 2003, 2003 IEEE International Symposium on Electromagnetic Compatibility, 2003. EMC '03..

Time Domain Delay Extraction-Based Macromodeling Algorithm for Long-Delay Networks

A. Charest, I. Erdin, N. Soveiko, 2010, IEEE Transactions on Advanced Packaging.

Circuit simulation of incident field coupling to multiconductor transmission lines with frequency-dependent losses

Ramachandra Achar, Anestis Dounavis, Michel Nakhla, 2001, 2001 IEEE EMC International Symposium. Symposium Record. International Symposium on Electromagnetic Compatibility (Cat. No.01CH37161).