MyoungSu Chae
发表
Eric Ouyang,
MyoungSu Chae,
E. Ouyang,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
Gwang Kim,
Billy Ahn,
Eric Ouyang,
2012
.
Improvement of ELK Reliability in Flip Chip Packages using Bond-on-Lead (BOL) Interconnect Structure
Seng Guan Chow,
Roger Emigh,
Raj Pendse,
2010
.