Jae Kyu Cho

发表

Thick photosensitive polyimide film side wall angle variability and scum improvement for IC packaging stress control

Sohan Singh Mehta, C. S. Premachandran, Fahad Mirza, 2018, Advanced Lithography.

A Generic Strategy to Assess and Mitigate Chip Package Interaction Risk Factors for Semiconductor Devices with Ultra-low k Dielectric Materials in Back End of Line

Michael Thiele, Dirk Breuer, Himani Kamineni, 2017 .

Chip Package Interaction: Understanding of Contributing Factors in Back End of Line (BEoL) Silicon, Cu Pillar Design and Applied Process Improvements

Dirk Breuer, Lily Zhao, Michael Hecker, 2018 .

Fault Diagnosis Method based on Support Vector Machine

En Sup Yoon, Chang Jun Lee, Jae Kyu Cho, 2004 .

JSS FOCUS ISSUE ON ADVANCED INTERCONNECTS :M ATERIALS ,P ROCESSING, AND RELIABILITY Chip Packaging Interaction (CPI) with Cu Pillar Flip Chip for 20 nm Silicon Technology and Beyond

Shan Gao, Seungman Choi, Jae Kyu Cho, 2015 .

Experiment of 22FDX(R) Chip Board Interaction (CBI) in Wafer Level Packaging Fan-Out (WLPFO)

Jae Kyu Cho, Frank Kuechenmeister, Jens Paul, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Chip Package Interaction (CPI) risk assessment of 22FDX® Wafer Level Chip Scale Package (WLCSP) using 2D Finite Element Analysis modeling

Dirk Breuer, Jae Kyu Cho, Frank Kuechenmeister, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

Package Qualification Envelope for 22FDX® Technology

Michael Thiele, Dirk Breuer, Bjoern Boehme, 2019 .

A CMOS Compatible Monolithic Fiber Attach Solution with Reliable Performance and Self-Alignment

Javier Ayala, Tymon Barwicz, Michal Rakowski, 2020, 2020 Optical Fiber Communications Conference and Exhibition (OFC).

Tunable attractive and repulsive interactions between pH-responsive microgels

L. Andrew Lyon, Jae Kyu Cho, Zhiyong Meng, 2009 .

Chip Board Interaction Analysis of 22-NM Fully Depeleted Silicon on Insulator (FD-SOI) Technology in Wafer Level Packaging (WLP)

Dirk Breuer, Jens Paul, Jae Kyu Cho, 2018, 2018 International Wafer Level Packaging Conference (IWLPC).

Crystallization behavior of soft, attractive microgels.

Jae Kyu Cho, Zhiyong Meng, Victor Breedveld, 2007, The journal of physical chemistry. B.