D. Wang

Meeting Green Computing Challenges

D. Wang, David Wang, 2008, 2008 10th Electronics Packaging Technology Conference.

Meeting Green Computing Challenges

D. Wang, D. Wang, 2007, 2007 International Symposium on High Density packaging and Microsystem Integration.

Cooling challenges and best practices for high density data and telecommunication centers

D. Wang, 2006, Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06..

A passive solution to a difficult data center environmental problem

D. Wang, D. Wang, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).