Hnin Wai Yin

Development of 25-$\mu{\rm m}$ -Pitch Microbumps for 3-D Chip Stacking

A. Kumar, V. Kripesh, Aibin Yu, 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Design and Development of Fine Pitch Copper/Low-K Wafer Level Package

V. Kripesh, Seung Wook Yoon, Hnin Wai Yin, 2008, 2008 10th Electronics Packaging Technology Conference.

Process Development and Reliability of Microbumps

V. Kripesh, J. Lau, Hnin Wai Yin, 2008, 2008 10th Electronics Packaging Technology Conference.

Development of Fine Pitch Solder Microbumps for 3D Chip Stacking

A. Kumar, V. Kripesh, Aibin Yu, 2008, 2008 10th Electronics Packaging Technology Conference.

Three dimensional interconnects with high aspect ratio TSVs and fine pitch solder microbumps

John H. Lau, Aibin Yu, Vaidyanathan Kripesh, 2009, 2009 59th Electronic Components and Technology Conference.