J. H. Lau

Development of 25-$\mu{\rm m}$ -Pitch Microbumps for 3-D Chip Stacking

A. Kumar, V. Kripesh, Aibin Yu, 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Syntheses and Analyses of Novel Schiff Base Ligands with NN'OS Coordination Spheres

J. H. Lau, Nicholas P. Deifel, J. Lau, 2016 .

TMA, DMA, DSC, and TGA of lead free solders

J. H. Lau, C. Chang, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

Analysis and Comparison of Diesel Fuel for Organic and Metal Content via MP-AES and GC-MS

J. H. Lau, Nicholas P. Deifel, 2015 .