Winnie Lu

Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous Integration

John H. Lau, Puru Bruce Lin, Cheng-Ta Ko, 2020, International Symposium on Microelectronics.

A Stochastic Birth-Death Model of Information Propagation Within Human Networks

Winnie Lu, Prasidh Chhabria, Prasidh Chhabria, 2020, ICCS.