Corey Reichman

ASSEMBLY AND RELIABILITY ASSESSMENT OF FINE PITCH TMV PACKAGE ON PACKAGE (PoP) COMPONENTS

Ahmer Syed, Heather McCormick, Lee Smith, 2009 .

Best of Conference Papers—2006

James E. Jaussi, Nokibul Islam, Mark B. Trobough, 2006 .

Crack initiation and growth in WLCSP solder joints

Robert Darveaux, Corey Reichman, Christopher J. Berry, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Field use environment for a FCBGA in a laptop computer application

Robert Darveaux, Corey Reichman, Christopher J. Berry, 2009, 2009 59th Electronic Components and Technology Conference.