Toshio Kasai

发表

Precision Machining of Magnetic Memory Disks : Mirror-cutting and Polishing Techniques(Topics on New Processing Technology, The Present State of Processing Limit and Process Design)

Toshio Kasai, 1977 .

427 Basic research of aspheric surface polishing method by r-θ coordinates system robot

Hitoshi Omori, Toshio Kasai, Mohammad Jashim Uddin, 2001 .

315 Mist Electro Discharge Truing Method of One Side V Face Cast Iron Bond Grinding Wheels

Toshio Kasai, Hitoshi Ohmori, Hisayoshi Shindo, 2001 .

Finishing characteristics of brittle materials by ELID-lap grinding using metal-resin bonded wheels

B. P. Bandyopadhyay, Toshio Kasai, Hitoshi Ohmori, 1998 .

Development of one-by-one polishing machine with soft chucking capable of automatic loading

Toshio Kasai, Masami Masuda, K. Horio, 1993 .

Photoemission Study on Natural Oxidation of Cu3Au with Synchrotron Radiation

Toshio Kasai, Daichi Yamazaki, Akitaka Yoshigoe, 2009 .

Measuring the Very Small Cutting-Edge Radius for a Diamond Tool Using a New Kind of SEM Having Two Detectors

Akira Kobayashi, Toshio Kasai, S. Asai, 1990 .

Past,Present and Future of Lapping and Polishing Machines (1)

Toshio Kasai, Ichiro Nishimura, Tomoyuki Yoneyama, 2007 .

The Study of Oxidation on TiAl Surface with Photoemission Spectroscopy in Conjunction with Synchrotron Radiation

Toshio Kasai, Yuichi Sumimoto, Yuden Teraoka, 2010 .

Consideration About The Progress Trend Of Semiconductor Industry (The 2nd News) -Analysis Of Present And Future In The Semiconductor Industry-

Toshio Kasai, Toshiro Doi, Yasuhiko Takeno, 2003 .

Soft Chucking in One-by-one Automatic Mirror Polishing of Silicon Wafers.

Toshio Kasai, Masami Masuda, Kiyoshi Akamatsu, 1993 .

Improvement of Conventional Polishing Conditions for Obtaining Super Smooth Surfaces of Glass and Metal Works

Toshio Kasai, Akira Kobayashi, Kenichiro Horio, 1990 .

Characteristics of ELID Surface Grinding by Fine Abrasive Metal-Resin Bonded Wheel

Toshio Kasai, Kenichiro Horio, T. Karaki-Doy, 1998 .

Comparative Study on Surfaces of Single-Crystalline Substrates. From Dielectric Substance to Semiconductor and Metal. Machining and Processing Technologies and Quality of Silicon Wafer Surfaces.

Toshio Kasai, 2000 .

Special Issue on Nanometer-scale Machining and Processing Technology - From the Viewpoint of Chemical/Physical Reaction on Surfaces. Grinding, Lapping and Polishing Technologies under Nanometer Scale Working Conditions.

Toshio Kasai, Toshiro K. Doy, 1993 .