Chengdi Xiao

Force-electrical characteristics of a novel mini-damper

Wei Wang, Fei Li, Can Zhou, 2016 .

An Electromechanical Model and Simulation for Test Process of the Wafer Probe

Can Zhou, Junhui Li, Qing Tian, 2017, IEEE Transactions on Industrial Electronics.

A New Automatic Testing System Based on Image Processing and Microprobes for IC-Testing

Can Zhou, Fei Li, Junhui Li, 2016, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Structural relationship model for design defect and influencing factors in the concurrent design process

Weidong Liu, Chengdi Xiao, Huimeng Zheng, 2018, Int. J. Prod. Res..

Automatic alignment and testing system for wafer with ball grid array

Junhui Li, Qing Tian, Chengdi Xiao, 2016 .

An activity-based defect management framework for product development

Weidong Liu, Chengdi Xiao, Huimeng Zheng, 2018, Comput. Ind. Eng..

Assessment of Hardware Product Design Defects by Fuzzy Neural Network Based on Genetic Algorithm

Weili Hu, Weidong Liu, Chengdi Xiao, 2014 .

Investigation on the defect induced thermal mechanical stress for TSV

Junhui Li, Chengdi Xiao, Wenhui Zhu, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

An effective and efficient numerical method for thermal management in 3D stacked integrated circuits

Junhui Li, Chengdi Xiao, Wenhui Zhu, 2017 .