M. Rachlin

Thermal modeling aids the design of packaged amplifiers

D. H. Chien, Chin C. Lee, T. Kole, 1997 .

Thermal analysis of packaged GaAs devices using chip model with finite element method

D. H. Chien, Chin C. Lee, T. Kole, 1997 .

A temperature compensated L-band variable gain amplifier with eight bit digital control

N. Scheinberg, M. Rachlin, Phillip W. Wallace, 1988, 10th Annual IEEE (GaAs IC) Symposium, Gallium Arsenide Integrated Circuit. Technical Digest 1988..

Thermal analysis and design of plastic packages for GaAs RF IC power amplifiers

D. H. Chien, Chin C. Lee, An-Yu Kuo, 1996, InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V.

Plastic packaging modeling and characterization at RF/microwave frequencies

A. Elshabini-Riad, M. Rachlin, A. Elshabini-Riad, 1997, Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces.