Wai-kin Li

Determining DOF requirements needed to meet technology process assumptions

Timothy A. Brunner, Allen H. Gabor, Shailendra Mishra, 2008, SPIE Advanced Lithography.

Impact of mask CD error on OPC performance for 65nm technology M1 level

Oseo Park, James M. Oberschmidt, Wai-kin Li, 2005, SPIE Photomask Technology.

Focus improvement with NIR absorbing underlayer attenuating substructure reflectivity

Wu-Song Huang, Martin Glodde, Seiichiro Tachibana, 2012, Other Conferences.

Is model-based optical proximity correction ready for manufacturing? Study on 0.12- and 0.175-μm DRAM technology

Lars W. Liebmann, Franz X. Zach, Bernhard Liegl, 2002, SPIE Advanced Lithography.

Resist freezing process for double exposure lithography

Wu-Song Huang, P. Rao Varanasi, Wai-kin Li, 2008, SPIE Advanced Lithography.

Self-Assembly Based Air-Gap Integration

Daniel C. Edelstein, Sampath Purushothaman, Matthew E. Colburn, 2008 .

Creation of sub-20-nm contact using diblock copolymer on a 300mm wafer for complementary metal oxide semiconductor applications

Wai-kin Li, Sam Yang, 2007 .