Hideo Miura

发表

Minimization of the local residual stress in 3DICs by controlling the structures and mechanical properties of 3D interconnections

Kota Nakahira, Fumiaki Endo, Ryosuke Furuya, 2012, 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.

Thermal stability of electroplated copper thin-film interconnections

Ken Suzuki, Hideo Miura, Pornvitoo Rittinon, 2015, 2015 International 3D Systems Integration Conference (3DIC).

Mechanical Stress Simulation for Highly Reliable Deep-Submicron Devices

Hideo Miura, Shuji Ikeda, H. Miura, 1999 .

Experimental Methods for Inspection and Reliability Evaluation of Electronic Packages and Modules

Hideo Miura, 2005 .

Analytical Study on Non-destructive measurement method for Open Failure in Interconnection Layer in Three-Dimensionally Stacked LSI Chips

Hideo Miura, Yuki Sato, 2004 .

Object-oriented CAE System for Structural Design of LSI Packages

Hideo Miura, Takeshi Terasaki, Kiyomi Kojima, 2000 .

A process for producing a package

Hideo Miura, Yoshiaki Watanabe, Mitsuhiro Dai Nippon Sumimoto, 1993 .

172 Development of the Residual Stress Monitoring Method During Manufacturing Process of 3D Electronic Packages

Ken Suzuki, Hideo Miura, Hironori Tago, 2013 .

Mechanical and electrical reliability of copper interconnections for 3DIC

Ken Suzuki, Hideo Miura, Naoki Saito, 2012, 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.

A Feasibility Study for Floating Offshore Windfarms in Japanese Waters

Izumi Ushiyama, Kazuichi Seki, Hideo Miura, 2004 .

Development of CAE System for Structural Design of LSI Packages

Hideo Miura, Takeshi Terasaki, Asao Nishimura, 2003 .

203 Mechanical Reliability Issues of Optical Integrated Circuits

Hideo Miura, Taira Kawauchi, 2005 .

W05-(6) Application of Computer Aided Engineering for Structural and Reliability Design of Electronic Packaging

Hideo Miura, 2001 .

実験計画法を用いたボンディングワイヤループ形状適正化の検討(J01-4 最適構造設計,J01 エレクトロニクス実装における熱制御および信頼性評価)

Hideo Miura, Satoru Konishi, Kenya Kawano, 2004 .

Research on Applicability of New Materials to Marine Structures in Tropical Climates: Specimens Exposed for 3 Years

Hideo Miura, Keisuke Yonemaru, Shigeo Tsujikawa, 2002 .

Experimental Methods for Reliability Evaluation of Electronic Packages and Modules

Hideo Miura, 2006 .

DEVELOPMENT OF A REAL TIME POSITIONING SYSTEM FOR WORKING VESSELS BY USING GPS

Koji Nakagawa, Takeshi Ishizaki, Tadao Hayashi, 1995 .

116 Development of in-line evaluation measurement method of the change of the residual stress in nano-scale transistor structures during manufacturing.

Ken Suzuki, Hideo Miura, Hiroki Kishi, 2010 .

Variation of thermal stress in TSV structures caused by crystallinity of electroplated copper interconnections

Ken Suzuki, Hideo Miura, Jiatong Liu, 2015, 2015 International 3D Systems Integration Conference (3DIC).

Stress Analysis of Transistor Structures Considering the Internal Stress of Thin Films

Hideo Miura, Hiroyuki Ohta, Naoto Saito, 1996 .

Effect of Process-Induced Mechanical Stress on Circuit Layout

Hideo Miura, Yasunobu Tanizaki, 1995 .

Improvement of the Long-Term Reliability of TSV Interconnections Used in Three-Dimensional Stacked Modules

Hideo Miura, H. Miura, Ken Suzuki, 2014 .

Thermal Stress Measurement in Silicon Chips Encapsulated in IC Plastic Packages Under Temperature Cycling

Hideo Miura, Makoto Kitano, Asao Nishimura, 1993 .

Molecular Dynamics Analysis of Grain-Boundary Grooving in Thin-Film Interconnects for ULSIs

Hideo Miura, Tomio Iwasaki, 1998 .

Effect of Micro Texture of Electroplated Copper Thin Films on Their Mechanical Properties

Hideo Miura, Kinji Tamakawa, H. Miura, 2007 .

Effect of external stress on polarization in ferroelectric thin films

Hideo Miura, Makoto Kitano, Tetsuo Kumazawa, 1998 .

Development and application of the stress sensing test chip for IC plastic packages.

Hideo Miura, Kunihiko Nishi, Asao Nishimura, 1987 .

Thermal Stress in Silicon Chips Encapsulated in IC Plastic Packages.

Hideo Miura, Kunihiko Nishi, Asao Nishimura, 1991 .

Numerical Analysis of Vacancy Transport by Residual Stress in Electromigration on LSI Interconnects

Hideo Miura, Tsutomu Murakawa, H. Miura, 2010 .

Thermal Stability of Pt Bottom Electrodes for Ferroelectric Capacitors

Yoshihisa Fujisaki, Hideo Miura, Yuichi Matsui, 1998 .