Bora Baloglu

Groove Geometry and Mold Shrinkage Effects on Die Stress in Flip Chip Molded BGAs (FCMBGA)

Ahmer Syed, Miguel Jimarez, Bora Baloglu, 2013 .

Warpage Characterization and Improvements for IC Packages with Coreless Substrate

Wei Lin, Miguel Jimarez, Bora Baloglu, 2013 .