G. Dehaine

Fine line multilayer substrates with very high density TAB

S. G. Tyler, K. Kurzweil, G. Dehaine, 1989, Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International Electronic Manufacturing Technology Symposium.

Single point ILB at narrow pitch

G. Dehaine, P. Courant, 1994 .

Density Upgrading in Tape Automated Bonding

K. Kurzweil, G. Dehaine, 1982 .

Fine pitch package mounting with TAB tape

G. Dehaine, J. Joly, J. Joly, 1989, Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International Electronic Manufacturing Technology Symposium.

Tab with bumpless chips

G. Dehaine, P. Courant, 1994, Workshop on MCM and VLSI Packaging Techniques and Manufacturing Technologies.