Zhenjiang Cui

Design and simulation of a vacuum micropump

Christos G. Takoudis, Zhenjiang Cui, 2001, MOEMS-MEMS.

Reliability of dielectric barriers in copper damascene applications

N. Rajagopalan, Zhenjiang Cui, A.S. Lee, 2003, IEEE International Integrated Reliability Workshop Final Report, 2003.

Benchmarking Four Point Bend Adhesion Testing: The Effect of Test Parameters On Adhesion Energy

Zhenjiang Cui, Reinhold H. Dauskardt, Girish Dixit, 2005 .

Effects of UV cure on glass structure and fracture properties of nanoporous carbon-doped oxide thin films

Zhenjiang Cui, Reinhold H. Dauskardt, Hichem M'Saad, 2008 .