P. Tiilikka

Experimental validation of numerical heat transfer predictions for singleand multi-component printed circuit boards in natural convection environments

J. Lohan, V. Eveloy, P. Rodgers, 1999, Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306).

Effect of both PCB thermal conductivity and nature of forced convection environment on component operating temperature: Experimental measurement and numerical prediction

J. Lohan, C.-M. Fager, P. Tiilikka, 2000, Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.00CH37068).

Applications of infrared thermography in electronics research

Reijo Lehtiniemi, J. Rantala, T. Aapro, 2000 .

Experimental and numerical investigation into the influence of printed circuit board construction on component operating temperature in natural convection

Peter Rodgers, J. Lohan, C.-M. Fager, 2000 .

Using experimental analysis to evaluate the influence of printed circuit board construction on the thermal performance of four package types in both natural and forced convection

Peter Rodgers, J. Lohan, C.-M. Fager, 2000, ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069).