H.S. Jeong

Highly reliable and mass-productive FRAM embedded smartcard using advanced integration technologies

S.Y. Lee, Kinam Kim, J.H. Park, 2004, Digest of Technical Papers. 2004 Symposium on VLSI Technology, 2004..

MLC PRAM with SLC write-speed and robust read scheme

Y.N. Hwang, G.T. Jeong, H.S. Jeong, 2010, 2010 Symposium on VLSI Technology.

Integration technologies for scalable high density MRAM

Jonghyun Park, S.Y. Lee, Kinam Kim, 2005, IEEE VLSI-TSA International Symposium on VLSI Technology, 2005. (VLSI-TSA-Tech)..

A novel cell-STP (storage node through plate node) cell-technology for multigigabit-scale DRAM and logic-embedded DRAM generations

Y.S. Hwang, B.J. Park, Y.S. Chun, 1999, International Electron Devices Meeting 1999. Technical Digest (Cat. No.99CH36318).

Integration and cell characteristics for high density PRAM

J.H. Park, K.N. Kim, S.J. Ahn, 2004, Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850).

Manufacturing Technologies for a Highly Reliable, 0.34 μm2-Cell, 64 Mb, and 1T1C FRAM

S.Y. Lee, Kinam Kim, J.H. Park, 2006, 2006 International Electron Devices Meeting.