M.J. Kobrinsky

Experimental validation of crosstalk simulations for on-chip interconnects at high frequencies using S-parameters

Dan Jiao, S. Chakravarty, M.J. Kobrinsky, 2003, Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710).

Comparisons of conventional, 3-D, optical, and RF interconnects for on-chip clock distribution

M.J. Kobrinsky, B.C. Barnett, Kuan-Neng Chen, 2004, IEEE Transactions on Electron Devices.

A novel technique for full-wave modeling of large-scale three-dimensional high-speed on/off-chip interconnect structures

D. Jiao, S. Chakravarty, M.J. Kobrinsky, 2003, International Conference on Simulation of Semiconductor Processes and Devices, 2003. SISPAD 2003..

Experimental validation of crosstalk simulations for on-chip interconnects using S-parameters

D. Jiao, S. Chakravarty, M.J. Kobrinsky, 2005, IEEE Transactions on Advanced Packaging.