T. Hasegawa

On the WYSIWYAS Car Park Navigation System

Jeyeon Kim, R. Masuda, T. Hasegawa, 2007, 2007 IEEE Intelligent Vehicles Symposium.

Development of 500-kV XLPE cables and accessories for long distance underground transmission lines-Part II: jointing techniques

M. Yamaguchi, T. Kubota, H. Noda, 1994 .

Identification of electromigration dominant diffusion path for Cu damascene interconnects and effect of plasma treatment and barrier dielectrics on electromigration performance

H. Shibata, T. Hasegawa, H. Shibata, 2004, 2004 IEEE International Reliability Physics Symposium. Proceedings.

Challenge of low-k materials for 130, 90, 65 nm node interconnect technology and beyond

H. Shibata, H. Kamijo, N. Nakamura, 2004, IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004..

BEOL process integration technology for 45 nm node porous low-k/copper interconnects

H. Shibata, N. Nakamura, N. Matsunaga, 2005, Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005..