H. Jaouen

FEM-based method to determine mechanical stress evolution during process flow in microelectronics. Application to stress-voiding

S. Orain, X. Federspiel, J.-C. Barbé, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

A constitutive single crystal model for the silicon mechanical behavior: applications to the stress induced by silicided lines and STI in MOS technologies

S. Orain, Florian Cacho, G. Cailletaud, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..