Angélique Raley

Novel patterning schemes and technologies for the sub 5nm era

Akiteru Ko, Peter Biolsi, Jeffrey Smith, 2018, 2018 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA).

Strategies for aggressive scaling of EUV multi-patterning to sub-20 nm features

Joe Lee, Akiteru Ko, Cody Murray, 2020, Advanced Lithography.

EUV patterning using CAR or MOX photoresist at low dose exposure for sub 36nm pitch

Akiteru Ko, Peter Biolsi, Danilo De Simone, 2018, Advanced Lithography.

Self-aligned blocking integration demonstration for critical sub-40nm pitch Mx level patterning

Jeffrey T. Smith, Xinghua Sun, Richard A. Farrell, 2017, Advanced Lithography.

Benchmarking of EUV lithography line/space patterning versus immersion lithography multipatterning schemes at equivalent pitch

Akiteru Ko, Eric Liu, Angélique Raley, 2018, Photomask Technology.

Novel bottom-up organic mandrel growth to enable organic mandrel EUV SADP for sub-5nm node technologies

Angélique Raley, David O'Meara, Katie Lutker-Lee, 2021, Advanced Lithography.

Line edge roughness reduction for EUV self-aligned double patterning by surface modification on spin-on-carbon and tone inversion technique

Peter Biolsi, Angélique Raley, Gregory Denbeaux, 2021 .