Andrew Metz

发表

Novel patterning schemes and technologies for the sub 5nm era

Akiteru Ko, Peter Biolsi, Jeffrey Smith, 2018, 2018 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA).

Towards production ready processing with a state-of-the-art EUV cluster

Nelson Felix, Takashi Saito, Nicole Saulnier, 2015, Advanced Lithography.

Plasma etch selectivity study and material screening for self-aligned gate contact (SAGC)

Andrew Metz, Farid Sebaai, Steven Demuynck, 2019, Advanced Lithography.

Engine for characterization of defects, overlay, and critical dimension control for double exposure processes for advanced logic nodes

Youri van Dommelen, Andrew Metz, Emil Schmitt-Weaver, 2009, Advanced Lithography.

Overcoming etch challenges related to EUV based patterning (Conference Presentation)

Peter Biolsi, Andrew Metz, Shinya Morikita, 2017, Advanced Lithography.

Resist process applications to improve EUV patterning

Akiteru Ko, Dominic Ashworth, Takashi Saito, 2013, Advanced Lithography.

The integration of 193i and DSA for BEOL metal cuts/blocks targeting sub-20nm tip-to-tip CD

Nelson Felix, Kafai Lai, Jing Guo, 2018, Advanced Lithography.

Electrical study of DSA shrink process and CD rectification effect at sub-60nm using EUV test vehicle

Yongan Xu, John Arnold, Nelson Felix, 2017, Advanced Lithography.

Plasma etch patterning of EUV lithography: balancing roughness and selectivity trade off

Lei Sun, Andrew Metz, Matthew E. Colburn, 2016, SPIE Advanced Lithography.

Evaluation of novel processing approaches to improve extreme ultraviolet (EUV) photoresist pattern quality

Warren Montgomery, Takashi Saito, Mark Neisser, 2015, Advanced Lithography.

Self-aligned blocking integration demonstration for critical sub-30-nm pitch Mx level patterning with EUV self-aligned double patterning

Yongan Xu, Akiteru Ko, Nelson Felix, 2018 .

DSA patterning options for logics and memory applications

Akiteru Ko, John Arnold, Nelson Felix, 2017, Advanced Lithography.

Utilization of spin-on and reactive ion etch critical dimension shrink with double patterning for 32 nm and beyond contact level interconnects

Andrew Metz, Karen Petrillo, Dave Horak, 2009, Advanced Lithography.

EUV patterning using CAR or MOX photoresist at low dose exposure for sub 36nm pitch

Akiteru Ko, Peter Biolsi, Danilo De Simone, 2018, Advanced Lithography.

Trench and hole patterning with EUV resists using dual frequency capacitively coupled plasma (CCP)

John Arnold, Andrew Metz, Kaushik Kumar, 2015, Advanced Lithography.

Coater/developer process integration of metal-oxide based photoresist

Takashi Saito, Michael Greer, Richard Farrell, 2015, Advanced Lithography.

Improvement of self-aligned dual patterning using spin-on-carbon mandrel

Peter Biolsi, Sophie Thibaut, Andrew Metz, 2020, Advanced Lithography.

DSA via hole shrink for advanced node applications

Nelson Felix, Kafai Lai, Martha I. Sanchez, 2016, SPIE Advanced Lithography.

EPE improvement thru self-alignment via multi-color material integration

Jeffrey T. Smith, Akiteru Ko, Carlos Fonseca, 2017, Advanced Lithography.

Controlling 2D aspect ratio of elliptical contact level interconnects utilizing spin-on and reactive ion etch critical dimension shrink for the 22-nm node

Karen Petrillo, Andrew Metz, Shinichiro Kawakami, 2010, Advanced Lithography.

Advanced multiple patterning technologies for high density hexagonal hole arrays

Akiteru Ko, Peter Biolsi, Sophie Thibaut, 2021, Advanced Lithography.