Steven E. Molis

Ultrathin (8-14 nm) Conformal SiN for sub-20 nm Copper/Low-k Interconnects

Daniel C. Edelstein, Alfred Grill, Jay Burnham, 2014 .

Low-k/copper integration scheme suitable for ULSI manufacturing from 90nm to 45nm nodes

Fen Chen, Daniel C. Edelstein, Ian D. Melville, 2005, SPIE Optics East.

Methods of producing plasma enhanced chemical vapor deposition silicon nitride thin films with high compressive and tensile stress

Ying Li, Anita Madan, Oleg Gluschenkov, 2008 .

Effective Cu surface pre-treatment for high-reliable 22nm-node Cu dual damascene interconnects with high plasma resistant ultra low-k dielectric (k=2.2)

Stephan A. Cohen, Anita Madan, C-K. Hu, 2012 .