M. Laure

Rules-based correction strategies setup on sub-micrometer line and space patterns for 200mm wafer scale SmartNIL process within an integration process flow

H. Teyssedre, L. Pain, P. Brianceau, 2017, Advanced Lithography.

Critical dimension uniformity characterization of nanoimprinted trenches for high volume manufacturing qualification

H. Teyssedre, L. Pain, S. Landis, 2016, European Mask and Lithography Conference.