Bioh Kim

Advanced wafer bonding solutions for TSV integration with thin wafers

Paul Lindner, Markus Wimplinger, Thorsten Matthias, 2009, 2009 IEEE International Conference on 3D System Integration.

300mm Wafer-Level Image Sensor Packaging

Gerald Mittendorfer, Paul Lindner, Alex Feldman, 2011 .

Through Silicon Via Technology: Cost effective Cu-TSV Interconnects by EMC3D and Technical Challenges with Cu-TSV

Rozalia Beica, Erik Young, Bioh Kim, 2010 .

Through-Silicon-Via Copper Deposition for Vertical Chip Integration

Bioh Kim, 2006 .

Effect of Post-Annealing Conditions on Cu-Cu Wafer Bonding Characteristics

Young-Bae Park, Seungmin Hyun, Thorsten Matthias, 2009 .

Annealing temperature effect on the Cu-Cu bonding energy for 3D-IC integration

Young-Bae Park, Thorsten Matthias, Bioh Kim, 2011 .

Thin wafer handling and processing-results achieved and upcoming tasks in the field of 3D and TSV

J. Burggraf, Bioh Kim, P. Kettner, 2009, 2009 11th Electronics Packaging Technology Conference.