Fei Chai
发表
Solder interconnect life prediction under complex temperature cycling with varing mean and amplitude
Fei Chai,
F. Chai,
2013
.
Huasheng Hong,
Shaoling Shang,
Caiyun Zhang,
2003,
SPIE Asia-Pacific Remote Sensing.
Strain-Range-Based Solder Life Predictions Under Temperature Cycling With Varying Amplitude and Mean
Michael Osterman,
Michael Pecht,
Fei Chai,
2014,
IEEE Transactions on Device and Materials Reliability.