P. Zarkesh-Ha

Performance improvement using on-board wires for on-chip interconnects

J.D. Meindl, A. Naeemi, P. Zarkesh-Ha, 2000, IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524).

Backend process optimization for 90 nm high-density ASIC chips

P. Zarkesh-Ha, P. Wright, S. Lakshminarayanan, 2003, Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695).