Se-Yong Oh

Design of CMOS voltage controlled oscillators using package inductor

J. Laskar, R. Tummala, S.-W. Yoon, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Development of thermal solution for high power flip chip CPU package

Min-Ha Kim, Joong-hyun Baek, Se-Yong Oh, 2000 .

SIP solution for high-end multimedia cellular phone

Nam-Seog Kim, Kiwon Choi, Seung-Bae Lee, 2003 .

Model-order estimation and reduction of distributed interconnects via improved vector fitting

Heeseok Lee, Yun-Seok Choi, Eunseok Song, 2005, IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005..

Reliability challenges of flip chip on organic substrate

Eun-Chul Ahn, Tae-Je Cho, Se-Yong Oh, 2002 .

A new efficient equivalent circuit extraction method for multi-port high speed package using multi-input multi-output transmission matrix and polynomial curve fitting

Kiwon Choi, Hee-Seok Lee, Tae-Je Cho, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..