Maximilian Schmid

发表

Transient thermal analysis for accelerated reliability testing of LEDs

Gordon Elger, D. Müller, Alexander Hanss, 2016, Microelectron. Reliab..

Analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations

Gordon Elger, Alexander Hanss, Maximilian Schmid, 2015, Microelectron. J..

The influence of voids in solder joints on thermal performance and reliability investigated with transient thermal analysis

Gordon Elger, Alexander Hanss, Maximilian Schmid, 2015, 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

Improving the Blockchain User Experience - An Approach to Address Blockchain Mass Adoption Issues from a Human-Centred Perspective

Maximilian Schmid, Leonhard Glomann, Nika Kitajewa, 2019 .

The influence of the phosphor layer as heat source and up-stream thermal masses on the thermal characterization by transient thermal analysis of modern wafer level high power LEDs

Gordon Elger, Alexander Hanss, Maximilian Schmid, 2016, Microelectron. Reliab..

Transient Thermal Analysis as In-Situ Method in Accelerated Stress Tests to Access Package Integrity of LEDs

Gordon Elger, Alexander Hanss, Maximilian Schmid, 2018, 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

Comparing prediction methods for LED failure measured with Transient Thermal Analysis

Gordon Elger, Maximilian Schmid, Andreas Zippelius, 2020, 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Magneto-thermoelectric effects in NiFe thin films

Maximilian Schmid, M. Schmid, 2015 .

Time Saving Averaging Algorithm for Transient Thermal Analyses over Deterministic Pulse Superposition

Gordon Elger, Alexander Hanss, Maximilian Schmid, 2019, 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

Analysis of new direct on PCB board attached high power flip-chip LEDs

Gordon Elger, Maximilian Schmid, Robert Derix, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Reliability of Sintered and Soldered High Power Chip Size Packages and Flip Chip LEDs

Gordon Elger, Alexander Hanss, Maximilian Schmid, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Evaluation of silver and copper sintering of first level interconnects for high power LEDs

Gordon Elger, Maximilian Schmid, Fosca Conti, 2018, 2018 7th Electronic System-Integration Technology Conference (ESTC).

The influence of phosphor layer and sidecoating on the thermal performance and the structure function of modern waver level high power LEDs

Gordon Elger, Alexander Hanss, Maximilian Schmid, 2015, 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

Transient thermal analysis as measurement method for IC package structural integrity

Gordon Elger, Maximilian Schmid, E Liu, 2015 .

Application of thermal analysis for the development of reliable high power LED modules

Gordon Elger, Alexander Hanss, Maximilian Schmid, 2014, 2014 11th China International Forum on Solid State Lighting (SSLCHINA).

Process development and reliability of sintered high power chip size packages and flip chip LEDs

Gordon Elger, Alexander Hanss, Maximilian Schmid, 2018, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).