Mahadevaiyer Krishnan

Measuring layer-specific depth-of-focus requirements

Allen H. Gabor, John M. Cotte, Colin J. Brodsky, 2008, SPIE Advanced Lithography.

IBM Research Report MEMS Fabrications for Wireless Communications Using Copper Interconnect Technology

David E. Seeger, Christopher V. Jahnes, Paivikki Buchwalter, 2005 .

Tool for chemical mechanical planarization with several spindles

Dennis G. Manzer, Mahadevaiyer Krishnan, Michael F. Lofaro, 2012 .

Electroless plating of copper at a low pH level

Mahadevaiyer Krishnan, Rangarajan Jagannathan, M. Krishnan, 1993, IBM J. Res. Dev..

A high performance 0.13 /spl mu/m copper BEOL technology with low-k dielectric

Daniel C. Edelstein, Sampath Purushothaman, Alina Deutsch, 2000, Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407).

Electromigration Cu mass flow in Cu interconnections

Robert Rosenberg, Andrew H. Simon, S. T. Chen, 2006 .

Chemical mechanical planarization: slurry chemistry, materials, and mechanisms.

Mahadevaiyer Krishnan, M. Krishnan, L. Cook, 2010, Chemical reviews.